ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,028, issued on March 25, was assigned to Tokyo Electron Ltd. (Tokyo).
"Plasma processing apparatus" was invented by Shuichi Takahashi (Miyagi, Japan), Takaharu Miyadate (Miyagi, Japan), Takaaki Kikuchi (Miyagi, Japan), Atsushi Ogata (Miyagi, Japan), Nobutaka Sasaki (Miyagi, Japan) and Takashi Taira (Miyagi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a plasma processing apparatus, a table has a wafer support to hold a wafer and a peripheral segment surrounding the wafer support and having through-holes. The peripheral segment has an upper surface lower than that of the wafer support. An outer focus ring is disposed over the peripheral s...