US Patent Issued to Tokyo Electron on March 18 for "Substrate processing system and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,063, issued on March 18, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing system and substrate processing method" was invented by Hayato Tanoue (Koshi, Japan), Takashi Uno (Koshi, Japan), Satoshi Ookawa (Koshi, Japan) and Suguru Enokida (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing system configured to process a substrate includes a first modifying apparatus configured to form, in a combined substrate in which a front surface of a first substrate and a front surface of a second substrate are bonded to each other, an internal modification layer elongated within the first substrate in a plane di...