ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,082, issued on March 18, was assigned to Tokyo Electron Ltd. (Tokyo).
"Substrate processing method" was invented by Yuta Hamashima (Kumamoto, Japan) and Jun Nonaka (Kumamoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method arranges a plurality of substrates in a storage area of a chamber, supplies an organic solvent to the plurality of substrates, arranges the plurality of substrates in a drying area, supplies a vapor of a hydrophobizing agent from a hydrophobizing agent nozzle to the plurality of substrates, arranges the plurality of substrates in the storage area, supplies an organic solvent from a first organic...