US Patent Issued to Tokyo Electron on March 18 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,081, issued on March 18, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Shinichi Hayashi (Koshi, Japan), Hiroaki Inadomi (Koshi, Japan), Shota Umezaki (Koshi, Japan), Suguru Enokida (Koshi, Japan) and Kouji Kimoto (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes multiple first substrate processing devices, one or more second substrate processing devices and a transfer unit. Each of the multiple first substrate processing devices is configured to process a substrate one by one. The one or more second substrate processi...