US Patent Issued to Tokyo Electron on March 11 for "Substrate transport apparatus and substrate transport method" (Japanese Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,527, issued on March 11, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate transport apparatus and substrate transport method" was invented by Isamu Taoda (Nirasaki, Japan) and Toshiaki Kodama (Nirasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate transport apparatus includes: a support configured to support a substrate; a moving mechanism configured to move the support in a lateral direction in order to transport the substrate from a first placement portion to a second placement portion, each of the first placement portion and the second placement portion being configured to place thereon the substrate; and an ultrasonic...