US Patent Issued to Tokyo Electron on June 3 for "Substrate processing method, modification device and substrate processing system" (Japanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,599, issued on June 3, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method, modification device and substrate processing system" was invented by Norifumi Kohama (Koshi, Japan) and Takayuki Ishii (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method of processing a substrate includes: forming a modification layer at least on a surface layer of a rear surface of the substrate or within the substrate by radiating a laser beam; and processing a front surface of the substrate in a state that the rear surface of the substrate is held. A modification device includes a laser irradiation unit configur...