US Patent Issued to Tokyo Electron on June 3 for "Shifted via-chain electrical-test measurements for hybrid bonding alignment correlation" (New York Inventor)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,661, issued on June 3, was assigned to Tokyo Electron Ltd. (Tokyo).

"Shifted via-chain electrical-test measurements for hybrid bonding alignment correlation" was invented by Kevin Ryan (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and corresponding methods of manufacturing the same are disclosed. For example, a semiconductor device includes a first semiconductor substrate and a second semiconductor substrate. A first portion of a test structure is disposed over the first substrate and a second portion of the test structure is disposed over the second substrate. The test structure includes intentionally offset port...