ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,039, issued on June 24, was assigned to Tokyo Electron Ltd. (Tokyo).
"Substrate processing apparatus and temperature regulation method" was invented by Tatsuya Watanabe (Yamanashi, Japan) and Yuichi Takenaga (Yamanashi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes: a processing container, a temperature adjustment unit, and a controller. The controller includes a calculation unit that calculates a correction temperature for uniformizing a film thickness within a plane of each substrate, a first temperature change amount calculation unit that calculates a first temperature change amount based on the co...