US Patent Issued to Tokyo Electron on June 24 for "Plurality of devices in adjacent 3D stacks in different circuit locations" (New York Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,603, issued on June 24, was assigned to Tokyo Electron Ltd. (Tokyo).

"Plurality of devices in adjacent 3D stacks in different circuit locations" was invented by H. Jim Fulford (Albany, N.Y.) and Mark I. Gardner (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the present disclosure provide 3D semiconductor structures and methods for fabricating the same. For example, the method can include forming a first multilayer stack over a substrate, forming a second multilayer stack over the first multilayer stack, forming a first opening through the first and second multilayer stack until uncovering a top surface of the substrate, form...