US Patent Issued to Tokyo Electron on June 17 for "Substrate transfer device and method of cooling arm" (Japanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,330,888, issued on June 17, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate transfer device and method of cooling arm" was invented by Takehiro Shindo (Nirasaki, Japan) and Wataru Matsumoto (Nirasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate transfer device that transfers a substrate, includes: a transfer arm including a substrate support and an arm; a cooler configured to distribute and supply a cooling fluid from a fluid supply source to each of cooling target regions of the arm; a measuring part configured to measure a temperature of each of the cooling target regions; and a controller. The controller is configured to:...