US Patent Issued to Tokyo Electron on June 17 for "Substrate processing method and substrate processing system" (Japanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,343, issued on June 17, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing system" was invented by Toru Hisamatsu (Miyagi, Japan), Takayuki Katsunuma (Miyagi, Japan), Shinya Ishikawa (Miyagi, Japan), Yoshihide Kihara (Miyagi, Japan) and Masanobu Honda (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a chamber; a substrate support disposed in the chamber; a gas supply that supplies a gas into the chamber; and a controller that controls an overall operation of the substrate processing apparatus. The controller executes a process including: (a) placin...