US Patent Issued to Tokyo Electron on June 17 for "Self-aligned method for vertical recess for 3D device integration" (New York, Vermont Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,274, issued on June 17, was assigned to Tokyo Electron Ltd. (Tokyo).

"Self-aligned method for vertical recess for 3D device integration" was invented by Jeffrey Smith (Clifton Park, N.Y.), Daniel Chanemougame (Niskayuna, N.Y.), Lars Liebmann (Mechanicsville, N.Y.), Paul Gutwin (Williston, Vt.), Subhadeep Kal (Albany, N.Y.), Kandabara Tapily (Mechanicsville, N.Y.) and Anton Devilliers (Clifton Park, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the present disclosure provide a self-aligned microfabrication method, which can include providing a substrate having vertically arranged first and second channel structures, forming first and...