ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,768, issued on June 10, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing system and substrate processing method" was invented by Hayato Tanoue (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing system includes: a modification layer forming device configured to form a modification layer within a first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate; an interface processing device configured to process an interface where the first substrate and a second substrate are bonded in the peripheral portion; a periphery removing device configu...