ALEXANDRIA, Va., July 9 -- United States Patent no. 12,351,905, issued on July 8, was assigned to Tokyo Electron Ltd. (Tokyo).
"Film forming method and film forming apparatus" was invented by Ryota Ifuku (Nirasaki, Japan), Makoto Wada (Nirasaki, Japan), Nobutake Kabuki (Nirasaki, Japan), Takashi Matsumoto (Nirasaki, Japan), Hiroshi Terada (Nirasaki, Japan) and Genji Nakamura (Nirasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A film forming method includes: a loading process of loading a substrate into a processing container; a first process of forming an interface layer having an amorphous structure or a microcrystalline structure on the substrate by plasma of a first mixed gas including a carbo...