US Patent Issued to Tokyo Electron on July 29 for "Wafer shape control for W2W bonding" (New York Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,562, issued on July 29, was assigned to Tokyo Electron Ltd. (Tokyo).

"Wafer shape control for W2W bonding" was invented by Anthony R. Schepis (Averill Park, N.Y.), Andrew Weloth (Albany, N.Y.), David C. Conklin (Saratoga Springs, N.Y.) and Anton J. Devilliers (Clifton Park, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method, for bonding a first wafer to a second wafer, includes generating a first modification map based on wafer shape data of the first wafer and the second wafer. The first modification map defines adjustments to internal stresses of the first wafer. A first wafer shape of the first wafer is modified by forming a first stres...