US Patent Issued to Tokyo Electron on July 29 for "Substrate treatment method and substrate treatment system" (Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,551, issued on July 29, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate treatment method and substrate treatment system" was invented by Yusuke Saito (Koshi, Japan), Makoto Muramatsu (Koshi, Japan) and Hiroyuki Fujii (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate treatment method for treating a substrate, includes: applying a coating solution containing an organometallic complex, a solvent, and an additive to the substrate to form a solution film of the coating solution; heating the substrate on which the solution film of the coating solution has been formed, to form an organic constituent-containing metal oxide fil...