US Patent Issued to Tokyo Electron on July 29 for "Substrate processing apparatus, substrate processing method, and chemical liquid" (Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,371,796, issued on July 29, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus, substrate processing method, and chemical liquid" was invented by Tetsuya Sakazaki (Kumamoto, Japan) and Hitoshi Kosugi (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes: supplying a first processing liquid containing a chelating agent and a solvent from a first tank toward a substrate having a film of a metal formed on a surface thereof to generate a complex containing the metal and the chelating agent while rotating the substrate; and supplying a second processing liquid containing water toward ...