US Patent Issued to Tokyo Electron on July 29 for "Substrate drying method and substrate drying apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,565, issued on July 29, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate drying method and substrate drying apparatus" was invented by Gentaro Goshi (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes: a pressure increasing process of increasing an internal pressure of a process container to a processing pressure by supplying a process fluid into the process container; and after the pressure increasing process, a circulating process of supplying the process fluid from a second discharge part into the process container and discharging the process fluid in the process container from a fluid discha...