US Patent Issued to Tokyo Electron on July 29 for "Recess filling method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,543, issued on July 29, was assigned to Tokyo Electron Ltd. (Tokyo).

"Recess filling method and substrate processing apparatus" was invented by Munehito Kagaya (Yamanashi, Japan) and Yusuke Suzuki (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A recess filling method includes a combined process including a film formation process of forming a film in recesses formed on the surface of a substrate and having different aspect ratios, and an etching process of etching the film formed in the recesses; and a repetition process of repeating the combined process n times (n is a natural number of 2 or more), wherein the repetition process in...