ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,573, issued on July 29, was assigned to Tokyo Electron Ltd. (Tokyo).

"Method for setting up test apparatus and test apparatus" was invented by Shinjiro Watanabe (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "One aspect of the present disclosure relates to a method of setting up a test apparatus that is a method of setting up the test apparatus to test a substrate by bringing a probe into contact with an electrode pad formed on a chip on the substrate that is mounted on a stage. The method includes acquiring a first image including the probe in a probe card that is attached to the test apparatus. The method includes calculating firs...