ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,030, issued on July 22, was assigned to Tokyo Electron Ltd. (Tokyo).
"Deposition method and deposition apparatus" was invented by Hitoshi Kato (Iwate, Japan), Yu Wamura (Iwate, Japan), Yuichiro Sase (Iwate, Japan), Yuji Sawada (Yamanashi, Japan) and Hiroyuki Kikuchi (Iwate, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A deposition apparatus including: a processing chamber; a rotary table provided in the processing chamber; a first processing region provided at a predetermined position in a circumferential direction of the rotary table; a second processing region provided downstream of the first processing region in the circumferential direct...