US Patent Issued to Tokyo Electron on July 15 for "Substrate processing apparatus, temperature control method of substrate processing apparatus, and program of control device for controlling substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,155, issued on July 15, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus, temperature control method of substrate processing apparatus, and program of control device for controlling substrate processing apparatus" was invented by Toshiharu Hirata (Yamanashi, Japan), Manabu Nakagawasai (Tokyo), Takashi Ishii (Tokyo) and Keiichi Iobe (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus, a method, and a program for controlling temperature of the substrate processing apparatus. A substrate processing apparatus comprising: a mounting table configured to hold a substrate to be processed in a va...