US Patent Issued to Tokyo Electron on July 15 for "Film forming method and semiconductor production apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,308, issued on July 15, was assigned to Tokyo Electron Ltd. (Tokyo).

"Film forming method and semiconductor production apparatus" was invented by Yusuke Suzuki (Nirasaki, Japan), Tsuyoshi Moriya (Nirasaki, Japan), Kazuhide Hasebe (Nirasaki, Japan), Atsushi Endo (Nirasaki, Japan) and Satoshi Tanaka (Nirasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film forming method is provided. In the film forming method, a mask is prepared based on a measurement result of a surface state of a substrate. The mask is transferred into a process chamber and the substrate is transferred into the process chamber. Then, a film is formed on a back surface ...