ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,314, issued on July 15, was assigned to Tokyo Electron Ltd. (Tokyo).
"Bonding apparatus and bonding method" was invented by Yuhei Matsuo (Koshi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding apparatus bonds a first substrate having a first alignment mark and a second substrate having a second alignment mark. A first radiation unit radiates white light to an imaging area of a first imaging unit when the second alignment mark is imaged by the first imaging unit. A second radiation unit radiates white light to an imaging area of a second imaging unit when the first alignment mark is imaged by the second imaging unit. A controller detec...