US Patent Issued to Tokyo Electron on July 15 for "Apparatus for transferring substrate and method for transferring substrate" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,215, issued on July 15, was assigned to Tokyo Electron Ltd. (Tokyo).

"Apparatus for transferring substrate and method for transferring substrate" was invented by Takehiro Shindo (Yamanashi, Japan), Dongwei Li (Yamanashi, Japan), Lingxin Jiang (Yamanashi, Japan), Shinya Okano (Yamanashi, Japan), Toshiaki Kodama (Yamanashi, Japan) and Wataru Matsumoto (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for transferring a substrate to a substrate processing chamber. The apparatus comprises: a substrate transfer chamber having a floor and a side wall; a substrate transfer module comprising a holder and second magnets, and confi...