US Patent Issued to Tokyo Electron on July 1 for "Substrate processing method and substrate processing system" (Japanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,676, issued on July 1, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing system" was invented by Yuichiro Wagatsuma (Nirasaki, Japan), Masahisa Watanabe (Nirasaki, Japan), Mayuko Nakamura (Nirasaki, Japan), Takashi Sakuma (Nirasaki, Japan), Osamu Yokoyama (Nirasaki, Japan) and Kwangpyo Choi (Nirasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes: preparing a substrate which includes a base having an epitaxial layer formed by epitaxial growth, and an insulating film formed on the base and having a penetration portion that exposes the epitaxial layer; formin...