US Patent Issued to Tokyo Electron on July 1 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,645, issued on July 1, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Shinya Morikita (Miyagi, Japan), Akira Hidaka (Miyagi, Japan) and Shu Kino (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method is for processing a substrate that includes a first region and a second region with compositions different from each other. The substrate processing method includes (a) preferentially forming, by a substrate processing apparatus, a first deposit on the first region; (b) forming, after (a), a second deposit on the second region, the second d...