ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,658, issued on July 1, was assigned to Tokyo Electron Ltd. (Tokyo).
"Stage and plasma processing apparatus" was invented by Ryota Sakane (Miyagi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A stage for mounting a substrate thereon, includes: an electrostatic chuck configured to attract the substrate; a base having a first region on which the electrostatic chuck is supported and a second region on which an edge ring arranged around the substrate is supported, the first region and the second region being divided by a groove extending in an annular shape; and a shield provided in the groove and configured to thermally separate the first region ...