US Patent Issued to Tokyo Electron on July 1 for "Semiconductor device manufacturing method and semiconductor device manufacturing system" (Japanese Inventor)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,671, issued on July 1, was assigned to Tokyo Electron Ltd. (Tokyo).

"Semiconductor device manufacturing method and semiconductor device manufacturing system" was invented by Tatsuya Yamaguchi (Nirasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device, includes forming a sacrificial film made of a polymer having a urea bond on a substrate by supplying an amine and an isocyanate to a surface of the substrate, wherein the sacrificial film is provided in a specific region of the substrate; performing a predetermined process on the substrate on which the sacrificial film is formed; and removing the sac...