ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,720, issued on Jan. 28, was assigned to Tokyo Electron Ltd. (Tokyo).

"Vacuum transfer device, substrate processing system, and substrate processing method" was invented by Tatsuo Hatano (Yamanashi, Japan), Naoki Watanabe (Yamanashi, Japan) and Tetsuya Miyashita (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A vacuum transfer device configured to transfer a substrate in a vacuum includes: a flat motor including a body, a plurality of electromagnetic coils arrayed in the body, and a current controller that controls a current supplied to the electromagnetic coil; a transfer unit including a substrate holder configured to hold a substr...