US Patent Issued to Tokyo Electron on Jan. 27 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,171, issued on Jan. 27, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Tomohiko Niizeki (Tokyo), Maju Tomura (Miyagi, Japan) and Yoshihide Kihara (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes: providing a substrate processing apparatus including a chamber, a substrate support that supports a substrate in the chamber, an upper electrode facing a center of the substrate, and a plurality of electromagnets arranged radially around the center of the upper electrode; selecting a polarity modification pattern to be used for ...