ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,720, issued on Jan. 27, was assigned to Tokyo Electron Ltd. (Tokyo).
"Bonding system" was invented by Takuo Kawauchi (Tokyo), Masataka Matsunaga (Koshi, Japan), Ryoichi Sakamoto (Koshi, Japan), Masaru Honda (Koshi, Japan) and Satoshi Nishimura (Koshi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A first transfer device and a second transfer device are configured to transfer a first substrate and a second substrate in a normal pressure atmosphere. A third transfer device is configured to transfer the first substrate and the second substrate in a decompressed atmosphere. A load lock chamber has accommodation sections allowed to accommodate the...