US Patent Issued to Tokyo Electron on Jan. 27 for "Bonding apparatus, bonding system, and bonding method" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,825, issued on Jan. 27, was assigned to Tokyo Electron Ltd. (Tokyo).

"Bonding apparatus, bonding system, and bonding method" was invented by Toshifumi Inamasu (Koshi, Japan) and Tetsuya Maki (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding apparatus includes a first holder, a second holder, a moving unit, a housing, an interferometer, a first gas supply and a second gas supply. The first holder is configured to attract and hold a first substrate. The second holder is configured to attract and hold a second substrate. The moving unit is configured to move a first one of the first holder and the second holder in a horizontal dire...