ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,153, issued on Jan. 20, was assigned to Tokyo Electron Ltd. (Tokyo).
"Processing method and processing apparatus" was invented by Takashi Sakaue (Kumamoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A processing method of processing a substrate in a processing apparatus includes performing a first grinding processing on the substrate in a first grinder; performing a second grinding processing on the substrate in a second grinder; performing a first re-grinding processing on the substrate in the first grinder; and performing a second re-grinding processing on the substrate in the second grinder. The substrate is ground to a final thickness ...