US Patent Issued to Tokyo Electron on Feb. 4 for "Substrate processing apparatus and electrostatic chuck" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,217,943, issued on Feb. 4, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and electrostatic chuck" was invented by Kohei Otsuki (Miyagi, Japan), Shin Yamaguchi (Miyagi, Japan) and Daisuke Satake (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus is provided. The apparatus comprises a chamber; a substrate support which is arranged in the chamber and has at least one first gas supply path; and at least one control valve configured to control a flow rate or pressure of gas supplied through the at least one first gas supply path. The substrate support includes a base, and an electrosta...