ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,217,941, issued on Feb. 4, was assigned to Tokyo Electron Ltd. (Tokyo).
"Plasma processing apparatus, and plasma processing method" was invented by Satoru Kawakami (Yamanashi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A plasma processing apparatus for cleaning a peripheral portion of a substrate by plasma and comprising a depressurizable processing container accommodating a substrate is disclosed. The processing container includes a substrate support for supporting a substrate and including a central electrode facing a central portion of the supported substrate supported by the substrate support; a lower ring electrode formed in a ring shape t...