US Patent Issued to Tokyo Electron on Feb. 3 for "Manufacturing method of chip-attached substrate and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,522, issued on Feb. 3, was assigned to Tokyo Electron Ltd. (Tokyo).

"Manufacturing method of chip-attached substrate and substrate processing apparatus" was invented by Hayato Tanoue (Kumamoto, Japan), Yasutaka Mizomoto (Kumamoto, Japan) and Yohei Yamashita (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a chip-attached substrate includes preparing a stacked substrate including multiple chips, a first substrate to which the multiple chips are temporarily bonded, and a second substrate bonded to the first substrate with the multiple chips therebetween; and separating the multiple chips bonded to the first subs...