US Patent Issued to Tokyo Electron on Feb. 25 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,178, issued on Feb. 25, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Masataka Gosho (Kumamoto, Japan) and Reijiro Yamanaka (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes: a processing container to which a supercritical fluid is supplied, the processing container being configured to dry a substrate by replacing a drying liquid collected on the substrate with the supercritical fluid; a discharge line configured to discharge a mixed fluid containing the supercritical fluid and the drying liquid from an interior of the proces...