US Patent Issued to Tokyo Electron on Feb. 10 for "Parameter setting method and substrate processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,007, issued on Feb. 10, was assigned to Tokyo Electron Ltd. (Tokyo).

"Parameter setting method and substrate processing apparatus" was invented by Hiroyuki Karasawa (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A parameter setting method includes: (a) acquiring a first index indicating a thermal effect of a temperature control of a temperature adjustment unit on a processing container of a substrate processing apparatus when no film is present on an inner surface of the processing container; (b) acquiring a film thickness of a film on the inner surface of the processing container, and a second index indicating a thermal effect of ...