ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,994, issued on Feb. 10, was assigned to Tokyo Electron Ltd. (Tokyo).
"Film forming method and film forming apparatus" was invented by Sena Fujita (Nirasaki, Japan), Tadashi Mitsunari (Nirasaki, Japan) and Takamichi Kikuchi (Nirasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A film forming method includes: supplying a liquid to a concave portion of a substrate whose surface includes the concave portion and a convex portion which are adjacent to each other; and selectively forming a film on a top surface of the convex portion of the surface of the substrate by supplying a processing gas, which chemically changes the liquid, to the surface ...