ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,491,600, issued on Dec. 9, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate warpage correction method, computer storage medium, and substrate warpage correction apparatus" was invented by Nozomu Kanetake (Koshi, Japan), Akihiro Kubo (Koshi, Japan), Teruhiko Kodama (Koshi, Japan), Taro Yamamoto (Koshi, Japan), Yasushi Takiguchi (Koshi, Japan), Yoshiki Okamoto (Koshi, Japan) and Hayato Hosaka (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate warpage correction method according to this disclosure corrects warpage of a substrate without performing a process on a front surface of the substrate. The substrate warpage correction me...