US Patent Issued to Tokyo Electron on Dec. 9 for "Substrate processing apparatus, substrate processing method and storage medium" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,390, issued on Dec. 9, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus, substrate processing method and storage medium" was invented by Toshiki Naeki (Koshi, Japan) and Kentaro Yamamura (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus for processing a substrate to be measured by a film thickness measurement device, includes: a heat treatment part configured to heat-treat a substrate coated with a coating film; and a fluid supply part configured to supply a fluid, which suppresses variations in a film thickness over time until the film thickness is measured by the film thickn...