ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,354, issued on Dec. 30, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Hiromitsu Sakaue (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a substrate processing apparatus comprising: a substrate transfer chamber having a floor provided with a first magnet a substrate transfer module including a stage on which a substrate is placed, a traveling plate disposed below the stage, and a second magnet having a repulsive force with respect to the first magnet, the substrate transfer module being configured to be movable in the substrate transfer c...