ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,038, issued on Dec. 23, was assigned to Tokyo Electron Ltd. (Tokyo).
"Wafer bonding overlay measurement system" was invented by Ilseok Son (Albany, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for overlay measurement is disclosed. The method includes receiving an image of a bonded wafer. The method includes generating, based on the image, a profile of the bonded wafer. The method includes adjusting, using the profile, an objective lens of a single-focus image-based infrared (IR) system to perform an overlay measurement of the bonded wafer."
The patent was filed on Jan. 11, 2024, under Application No. 18/410,770.
*For further inform...