ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,191, issued on Dec. 16, was assigned to Tokyo Electron Ltd. (Tokyo).
"Phase change interconnects and methods for forming the same" was invented by Robert D. Clark (Fremont, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A structure of a semiconductor package is disclosed. The structure includes a first substrate including a first interconnect structure. The structure includes a second substrate including a second interconnect structure, the second substrate bonded to the first substrate. The structure includes a connection pad interposed between the first interconnect structure and the second interconnect structure. The connection pad include...