ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,378,670, issued on Aug. 5, was assigned to Tokyo Electron Ltd. (Tokyo).
"Substrate processing method" was invented by Tetsuro Shirasaka (Koshi, Japan) and Naoto Nakamura (Koshi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A controller performs an adjustment processing including: forming a film on a surface of a substrate by a film forming unit; removing a peripheral portion of the film by the film forming unit; acquiring surface information indicating a state of the surface of the substrate including the film, from which the peripheral portion has been removed, by a surface inspection unit and adjusting a cut width of the peripheral portion base...