US Patent Issued to Tokyo Electron on Aug. 5 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,377,519, issued on Aug. 5, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Nobutaka Fukunaga (Kumamoto, Japan), Masakazu Yarimitsu (Kumamoto, Japan), Katsuhisa Fujii (Kumamoto, Japan) and Hidejiro Ryu (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a rotary table configured to move each of multiple substrate chucks to, in sequence, a carry-in position where a carry-in of a substrate is performed, a processing position where thinning of the substrate is performed, and a carry-out position where a carry-out of the substrat...