US Patent Issued to Tokyo Electron on Aug. 5 for "Bonded substrate peripheral laser processing method and substrate processing apparatus thereof" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,085, issued on Aug. 5, was assigned to Tokyo Electron Ltd. (Tokyo).

"Bonded substrate peripheral laser processing method and substrate processing apparatus thereof" was invented by Hayato Tanoue (Kumamoto, Japan), Yohei Yamashita (Kumamoto, Japan) and Yasutaka Mizomoto (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method of a combined substrate in which a first substrate having a surface film stacked thereon and a second substrate are bonded to each other includes separating the first substrate as a removing target from the second substrate; and removing or modifying at least a surface layer of the surface fil...