ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,118, issued on Aug. 5, was assigned to Tokyo Electron Ltd. (Tokyo).

"3D multiple location compressing bonded arm for advanced integration" was invented by Andrew Weloth (Albany, N.Y.), Daniel Fulford (Ballston Lake, N.Y.), Anthony Schepis (Averill Park, N.Y.), Mark I. Gardner (Cedar Creek, Texas), H. Jim Fulford (Marianna, Fla.), Anton Devilliers (Clifton Park, N.Y.) and David Conklin (Saratoga Springs, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the present disclosure provide a bonding device for bonding two wafers. For example, the bonding device can include a first bonding chuck and a second bonding chuck. The first bonding chuc...