US Patent Issued to Tokyo Electron on Aug. 26 for "Substrate processing system and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,208, issued on Aug. 26, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing system and substrate processing method" was invented by Hiroki Endo (Miyagi, Japan) and Kenichiro Nakamura (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing system includes a stage on which a substrate is placed, a heater configured to heat the substrate by being supplied with power, a power supply part configured to supply power to the heater, a sensor configured to measure a resistance value of the heater, and a controller. The controller is configured to: store a conversion table in which a plurality of resistance values a...